Asia Express - East Asian ICT
Construction on India's First Fab Begins
July 01, 2005
Construction of India's first wafer fab commenced on June 26 in Andhra Pradesh, and is expected to be completed in the second half of 2006. Eight-inch wafers produced at the facility will be used to make low-cost chips for TVs, DVDs, LCD driver ICs, mobile phones, PCs, and automotive ICs. Monthly capacity is expected to be 30,000 chips.